H1B Filing Details
Case Number: I-200-22201-364315
Filing Information
- Employer
- Qualcomm Technologies
- Job Title
- Senior Staff Packaging Engineer (ASICS)
- Occupation (SOC)
- Electronics Engineers, Except Computer (17-2072.00)
- Salary Range
- $164,400 - $246,600 / Year
- Work Site Location
- Chandler, AZ
- Decision Date
- July 27, 2022
- Case Status
- Certified