H1B Filing Details
Case Number: I-200-18362-809525
Filing Information
- Employer
- Micron Technology
- Job Title
- 3DXP PRODUCT ENGINEER
- Occupation (SOC)
- Electronics Engineers, Except Computer (17-2072)
- Salary Range
- $118,789 / Year
- Work Site Location
- Lehi, UT
- Decision Date
- January 4, 2019
- Case Status
- Certified