H1B Filing Details
Case Number: I-200-18065-183218
Filing Information
- Employer
- Qualcomm Technologies
- Job Title
- PACKAGING ENGINEER
- Occupation (SOC)
- Electronics Engineers, Except Computer (17-2072)
- Salary Range
- $97,302 - $116,900 / Year
- Work Site Location
- San Diego, CA
- Decision Date
- March 12, 2018
- Case Status
- Certified