H1B Filing Details

Case Number: I-200-12178-554569

Certified

Fiscal Year

FY2012

Salary

$72,500

Work Location

Boise, ID

Visa Class

H-1B

Filing Information

Employer: Micron Technology
Job Title: R&D PACKAGING ENGINEER
Occupation (SOC): Electronics Engineers, Except Computer (17-2072)
Salary Range: $72,500 / Year
Work Site Location: Boise, ID
Decision Date: July 2, 2012
Case Status: Certified

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