H1B Filing Details

Case Number: I-200-12061-114135

Certified

Fiscal Year

FY2012

Salary

$73,000

Work Location

Boise, ID

Visa Class

H-1B

Filing Information

Employer: Micron Technology
Job Title: ASSEMBLY PACKAGE DESIGN ENGINEER
Occupation (SOC): Electronics Engineers, Except Computer (17-2072)
Salary Range: $73,000 / Year
Work Site Location: Boise, ID
Decision Date: March 7, 2012
Case Status: Certified

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