H1B Filing Details
Case Number: I-200-12045-353825
Filing Information
- Employer
- Micron Technology
- Job Title
- R&D DRY ETCH PROCESS DEV. ENGINEER
- Occupation (SOC)
- Mechanical Engineers (17-2141)
- Salary Range
- $90,000 / Year
- Work Site Location
- Boise, ID
- Decision Date
- February 21, 2012
- Case Status
- Certified