H1B Filing Details
Case Number: I-200-25168-103998
Filing Information
- Employer
- Micron Technology
- Job Title
- PRINCIPAL ENGINEER, ADVANCED PACKAGING
- Occupation (SOC)
- Materials Engineers (17-2131.00)
- Salary Range
- $149,023 / Year
- Work Site Location
- Boise, ID
- Decision Date
- June 25, 2025
- Case Status
- Certified