H1B Filing Details
Case Number: I-200-25122-932474
Filing Information
- Employer
- NXP USA
- Job Title
- Semiconductor Packaging Engineer
- Occupation (SOC)
- Materials Engineers (17-2131.00)
- Salary Range
- $155,530 / Year
- Work Site Location
- Austin, TX
- Decision Date
- May 9, 2025
- Case Status
- Certified