H1B Filing Details
Case Number: I-200-20260-826875
Filing Information
- Employer
- Microchip Technology
- Job Title
- Packaging Engineer
- Occupation (SOC)
- Materials Engineers (17-2131.00)
- Salary Range
- $66,539 - $85,000 / Year
- Work Site Location
- Chandler, AZ
- Decision Date
- September 23, 2020
- Case Status
- Certified