H1B Filing Details
Case Number: I-200-19058-361664
Filing Information
- Employer
- Micron Technology
- Job Title
- PRODUCT ENGINEER 3DXP
- Occupation (SOC)
- Electrical Engineers (17-2071)
- Salary Range
- $85,000 / Year
- Work Site Location
- Boise, ID
- Decision Date
- March 9, 2019
- Case Status
- Certified