H1B Filing Details

Case Number: I-200-18155-955062

Certified

Fiscal Year

FY2018

Salary

$97,288

Work Location

Boise, ID

Visa Class

H-1B

Filing Information

Employer: Micron Technology
Job Title: THINNING & BONDING PROCESS DEVELOPMENT ENGINEER
Occupation (SOC): Materials Engineers (17-2131)
Salary Range: $97,288 / Year
Work Site Location: Boise, ID
Decision Date: June 11, 2018
Case Status: Certified

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