H1B Filing Details
Case Number: I-200-18045-447812
Filing Information
- Employer
- Microchip Technology
- Job Title
- ENGINEER, PACKAGING
- Occupation (SOC)
- Materials Engineers (17-2131)
- Salary Range
- $59,571 - $90,000 / Year
- Work Site Location
- Chandler, AZ
- Decision Date
- February 22, 2018
- Case Status
- Certified