H1B Filing Details
Case Number: I-200-16113-556209
Filing Information
- Employer
- Micron Technology
- Job Title
- LEAD CMP DEVELOPMENT ENGINEER
- Occupation (SOC)
- Materials Engineers (17-2131)
- Salary Range
- $123,350 / Year
- Work Site Location
- Boise, ID
- Decision Date
- May 23, 2016
- Case Status
- Certified