H1B Filing Details

Case Number: I-200-15135-853634

Certified

Fiscal Year

FY2015

Salary

$111,138

Work Location

Boise, ID

Visa Class

H-1B

Filing Information

Employer: Micron Technology
Job Title: ADVANCED PACKAGING R&D DIE STACKING AND DIE ATTACH ENGINEER
Occupation (SOC): Materials Engineers (17-2131)
Salary Range: $111,138 / Year
Work Site Location: Boise, ID
Decision Date: May 26, 2015
Case Status: Certified

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