H1B Filing Details
Case Number: I-200-14272-031043
Filing Information
- Employer
- Micron Technology
- Job Title
- R&D DRY ETCH PROCESS ENGINEER
- Occupation (SOC)
- Materials Engineers (17-2131)
- Salary Range
- $88,700 / Year
- Work Site Location
- Boise, ID
- Decision Date
- October 6, 2014
- Case Status
- Certified