H1B Filing Details
Case Number: I-200-11216-024924
Filing Information
- Employer
- Micron Technology
- Job Title
- PACKAGING MATERIALS ENGINEER
- Occupation (SOC)
- Materials Engineers (17-2131)
- Salary Range
- $85,500 / Year
- Work Site Location
- Boise, ID
- Decision Date
- August 10, 2011
- Case Status
- Certified