H1B Filing Details
Case Number: I-200-10271-821259
Filing Information
- Employer
- Micron Technology
- Job Title
- R&D DIE ATTACH ENGINEER
- Occupation (SOC)
- Electrical Engineers (17-2071.00)
- Salary Range
- $72,500 / Year
- Work Site Location
- Boise, ID
- Decision Date
- November 1, 2010
- Case Status
- Certified