H1B Filing Details

Case Number: I-200-10027-230552

Certified

Fiscal Year

FY2010

Salary

$81,622

Work Location

N/A

Visa Class

H-1B

Filing Information

Employer: Qualcomm
Job Title: PACKAGING ENGINEER
Occupation (SOC): Materials Engineers (17-2131.00)
Salary Range: $76,794 - $86,450 / Year
Work Site Location: Not specified
Decision Date: February 3, 2010
Case Status: Certified

Back to All Filings View Qualcomm Profile