H1B Filing Details
Case Number: I-09008-4619211
Filing Information
- Employer
- Micron Technology
- Job Title
- PACKAGING MATERIALS ENGINEER
- Occupation (SOC)
- 19.0 (19.0)
- Salary Range
- $78,437 / Year
- Work Site Location
- Boise, ID
- Decision Date
- January 8, 2009
- Case Status
- Certified