H1B Filing Details
Case Number: I-09007-4617393
Filing Information
- Employer
- Micron Technology
- Job Title
- INTERPOSER/MATERIALS ENGINEER
- Occupation (SOC)
- 7.0 (7.0)
- Salary Range
- $80,180 / Year
- Work Site Location
- Boise, ID
- Decision Date
- January 7, 2009
- Case Status
- Certified