PROCESS DEVELOPMENT ENGINEER
1 H1B filings at Micron Technology in FY2015
1
Total Filings
$90,000
Median Salary
100.0%
Approval Rate
1
Certified (0 denied)
Salary Distribution
Range shows where 80% of salaries fall. The marker indicates the median.
Range: $90,000 - $90,000
Salary Frequency
Hover over bars to see exact counts. Salary ranges in $25K increments.
Work Locations
BOISE, ID
1 filings
All Filings (16)
| Job Title | Location | Salary | Year | Status | View |
|---|---|---|---|---|---|
| PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $84,825 | FY2015 | CERTIFIED | View |
| CVD THIN FILMS PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $93,800 | FY2015 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $94,395 | FY2015 | CERTIFIED | View |
| THIN FILMS PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $91,380 | FY2015 | CERTIFIED | View |
| CMP PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $93,600 | FY2015 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $92,700 | FY2015 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $89,300 | FY2015 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $86,740 | FY2015 | CERTIFIED | View |
| PROCESS DEVELOPMENT ENGINEER - CMP 17-2041 | Boise, ID | $90,450 | FY2015 | CERTIFIED | View |
| THINNING AND BONDING PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $91,400 | FY2015 | CERTIFIED | View |
| PLASMA ETCH PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $108,588 | FY2015 | CERTIFIED | View |
| PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $105,000 | FY2015 | CERTIFIED | View |
| PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $90,000 | FY2015 | CERTIFIED | View |
| PVD PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $89,800 | FY2015 | CERTIFIED | View |
| PHOTO PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $95,200 | FY2015 | CERTIFIED | View |
| R&D PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $86,000 | FY2015 | CERTIFIED | View |
PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $84,825 FY2015
CVD THIN FILMS PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $93,800 FY2015
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $94,395 FY2015
THIN FILMS PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $91,380 FY2015
CMP PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $93,600 FY2015
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $92,700 FY2015
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $89,300 FY2015
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $86,740 FY2015
PROCESS DEVELOPMENT ENGINEER - CMP CERTIFIED
Boise, ID $90,450 FY2015
THINNING AND BONDING PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $91,400 FY2015
PLASMA ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $108,588 FY2015
PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $105,000 FY2015
PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $90,000 FY2015
PVD PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $89,800 FY2015
PHOTO PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $95,200 FY2015
R&D PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $86,000 FY2015