PROCESS DEVELOPMENT ENGINEER
2 H1B filings at Micron Technology in FY2012
2
Total Filings
$90,000
Median Salary
100.0%
Approval Rate
2
Certified (0 denied)
Salary Distribution
Range shows where 80% of salaries fall. The marker indicates the median.
Range: $88,000 - $92,000
Salary Frequency
Hover over bars to see exact counts. Salary ranges in $25K increments.
Work Locations
BOISE, ID
2 filings
All Filings (27)
| Job Title | Location | Salary | Year | Status | View |
|---|---|---|---|---|---|
| THIN FILM PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $100,797 | FY2012 | CERTIFIED | View |
| R&D NAND FLASH PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $90,000 | FY2012 | CERTIFIED | View |
| CMP PROCESS DEVELOPMENT ENGINEER - PRINCIPAL 17-2131 | Boise, ID | $136,100 | FY2012 | CERTIFIED | View |
| THINS FILMS PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $88,000 | FY2012 | CERTIFIED | View |
| THINNING AND BONDING PROCESS DEVELOPMENT ENGINEER 17-2141 | Boise, ID | $87,000 | FY2012 | CERTIFIED | View |
| THINS FILMS PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $88,000 | FY2012 | DENIED | View |
| CMP PROCESS DEVELOPMENT ENGINEER - PRINCIPAL 17-2131 | Boise, ID | $136,100 | FY2012 | CERTIFIED | View |
| PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $88,000 | FY2012 | CERTIFIED | View |
| CMP PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $89,000 | FY2012 | CERTIFIED | View |
| PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $92,000 | FY2012 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $73,500 | FY2012 | CERTIFIED | View |
| THIN FILM PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $113,200 | FY2012 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $93,000 | FY2012 | CERTIFIED | View |
| THIN FILMS PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $92,000 | FY2012 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2071 | Boise, ID | $87,000 | FY2012 | CERTIFIED | View |
| PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $100,000 | FY2012 | CERTIFIED | View |
| THIN FILMS PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $92,000 | FY2012 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $93,000 | FY2012 | CERTIFIED | View |
| DRY ETCH PROCESS DEVELOPMENT ENGINEER 17-2141 | Boise, ID | $73,500 | FY2012 | CERTIFIED | View |
| PLASMA ETCH PROCESS DEVELOPMENT ENGINEER 17-2131 | Boise, ID | $93,900 | FY2012 | CERTIFIED | View |
| CMP PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $87,000 | FY2012 | CERTIFIED | View |
| PROCESS DEVELOPMENT ENGINEER, R&D ASSEMBLY 17-2072 | Boise, ID | $72,500 | FY2012 | CERTIFIED | View |
| SR. WAFER PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $97,000 | FY2012 | CERTIFIED | View |
| SR. WAFER PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $105,000 | FY2012 | CERTIFIED | View |
| PHOTOLITOGRAPHY PROCESS DEVELOPMENT ENGINEER 17-2072 | Boise, ID | $100,000 | FY2012 | CERTIFIED | View |
THIN FILM PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $100,797 FY2012
R&D NAND FLASH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $90,000 FY2012
CMP PROCESS DEVELOPMENT ENGINEER - PRINCIPAL CERTIFIED
Boise, ID $136,100 FY2012
THINS FILMS PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $88,000 FY2012
THINNING AND BONDING PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $87,000 FY2012
THINS FILMS PROCESS DEVELOPMENT ENGINEER DENIED
Boise, ID $88,000 FY2012
CMP PROCESS DEVELOPMENT ENGINEER - PRINCIPAL CERTIFIED
Boise, ID $136,100 FY2012
PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $88,000 FY2012
CMP PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $89,000 FY2012
PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $92,000 FY2012
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $73,500 FY2012
THIN FILM PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $113,200 FY2012
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $93,000 FY2012
THIN FILMS PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $92,000 FY2012
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $87,000 FY2012
PHOTOLITHOGRAPHY PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $100,000 FY2012
THIN FILMS PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $92,000 FY2012
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $93,000 FY2012
DRY ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $73,500 FY2012
PLASMA ETCH PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $93,900 FY2012
CMP PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $87,000 FY2012
PROCESS DEVELOPMENT ENGINEER, R&D ASSEMBLY CERTIFIED
Boise, ID $72,500 FY2012
SR. WAFER PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $97,000 FY2012
SR. WAFER PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $105,000 FY2012
PHOTOLITOGRAPHY PROCESS DEVELOPMENT ENGINEER CERTIFIED
Boise, ID $100,000 FY2012