Microelectronics Packaging Thermal Engineer
1 H1B filings at IBM in FY2025
1
Total Filings
$166,060
Median Salary
100.0%
Approval Rate
1
Certified (0 denied)
Salary Distribution
Range shows where 80% of salaries fall. The marker indicates the median.
Range: $166,060 - $166,060
Salary Frequency
Hover over bars to see exact counts. Salary ranges in $25K increments.
Work Locations
Hopewell Junction, NY
1 filings
All Filings (1)
| Job Title | Location | Salary | Year | Status | View |
|---|---|---|---|---|---|
| Microelectronics Packaging Thermal Engineer 17-2061.00 | Hopewell Junction, NY | $166,060 | FY2025 | Certified | View |